IPC Performance Test Methods and Qualification Requirements for Surface Mount Solder Attachments. IPC CD: PERFORMANCE TEST METHODS AND QUALIFICATION REQUIREMENTS FOR SURFACE MOUNT SOLDER ATTACHMENTS. Reliability of FPGA Assemblies. Pb/Sn & Pb-free Solders. Tested per IPC A by. Reza Ghaffarian, Ph.D. NASA-Jet Propulsion Laboratory, Caltech.

Author: Aragis Voodoozahn
Country: Liberia
Language: English (Spanish)
Genre: Spiritual
Published (Last): 10 December 2010
Pages: 223
PDF File Size: 9.30 Mb
ePub File Size: 11.95 Mb
ISBN: 301-9-51369-522-8
Downloads: 88328
Price: Free* [*Free Regsitration Required]
Uploader: Shaktiramar

The results from different test programs can be compared to provide an understanding of design icp for adequate reliability. Provides specific test methods to evaluate the performance and reliability of surface mount solder attachments of electronic assemblies.

Common test specifications include:. Common test specifications include: Per IPC, temperature extremes are based on the product category with the low temperature usually 25C below the glass transition temperature Tg of the printed circuit board material.

  KISNER AND COLBY 6TH EDITION PDF

Revision A includes Appendix B which provides recommended changes to the thermal cycling profiles given in the document when utilizing Pb-free solder joints.

To view this site, you must enable JavaScript or upgrade to a JavaScript-capable browser.

Whether you 901 trying to implement a new solder type or new component types, solder joint reliability testing is essential in providing confidence that your product will perform within its intended operating limits. Product Description Product Details Back.

Javascript is disabled on your browser. Representative temperature iipc for thermal cycle test conditions. Thermal Cycling is usually performed at a transition rate of less than or equal to 20C per minute usually 10 to 14C per minute to avoid thermal shock with cycles per hour.

Establishes levels of performance and reliability of the solder attachments of surface mount 99701 to rigid, flexible and rigid-flex circuit structures. When used with IPC-SM, it provides an understanding of the physics of SMT solder joint failure and an approximate means of relating performance tests results to the reliability of solder attachments in their use environments.

  I JUCA PIRAMA DE GONALVES DIAS PDF

Solder Joint Reliability | NTS

Training Media Permissible Uses. See More See Less.

This provides you with useful technical information for future designs, saving you time and money. The electrical resistance is continuously monitored during testing using data loggers.

Solder Joint Reliability

We will continue to accept orders via e-mail and web during our office closure. Thermal Cycling is the most common method of testing Solder Joint Reliability. Please allow 2 business days for us to review and process your order.